152022-09
DIP24 DBC系列智能功率模块系列采用芯能新一代自研栅驱动芯片和IGBT芯片。
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152022-09
DIP24 IPM uses an insulated metal substrate (IMS) to achieve low thermal resistance and high power density, small package size, and a low-cost solution of more than 200W. The maximum current can be extended to 10A. At present, it has been widely used in a
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152022-09
DIP24 IPM采用绝缘金属基板(IMS)，实现低热阻和高功率密度，封装尺寸小，提供200W以上低成本解决方案，产品最大电流可扩展至10A。目前已广泛应用于油烟机风机，洗衣机等应用领域。
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